Compact form factor - 3.2x3.2cm board suitable for space-constrained, low-power designs.
Supported QFP packages - Compatible with 48, 64, 100, and 144-pin QFP footprints.
VCC bus runs along all four edges of the top side.
GND bus runs along all four edges of the bottom side.
Buses are positioned adjacent to breakout pads, simplifying MCU power routing and decoupling capacitor placement.
Ruler markings function as a pin-identification aid, printed adjacent to the top-side pads to mitigate the difficulty of locating pins on a small board.
Underside reserved as a prototyping zone for 0201 surface-mount components.
Salvage-friendly design - Enables rapid MCU prototyping using components reclaimed from discarded mobile devices.

This project received funding through NGI0 Entrust, a fund established by NLnet with financial support from the European Commission's Next Generation Internet program. Learn more at the NLnet project page.