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![Header Image](docs/images/UNBRK_HEX_Banner.jpg)
<div align="center">
<img src="docs/images/UNBRK_HEX.png" style="max-width: 100%; height: auto";>
</div>
# UNBRK HEX
<div align="center">
<img src="docs/images/UNBRK_HEX.png" width="400" height="400">
</div>
The UNBRK HEX is an improved and hexagonal version of the UNBRK breakout board. Like its predecessor, it supports QFP packages of 48, 64, 100, or 144 pins.
The UNBRK HEX is an improved and hexagonal version of the UNBRK breakout board. Improvements include being able to work at multiple, non-rectilinear angles for improved visibiliy, wider traces for improved low-power operation
of MCUs, the ability to add header pins and an improved 0201 prototyping grid.
### Features:
- Compact form factor suitable for space-constrained, low-power designs.
- Supported QFP packages - Compatible with 48, 64, 100, and 144-pin QFP footprints.
- VCC bus runs along all six edges of the top side.
- GND bus runs along all six edges of the bottom side.
- Buses are positioned adjacent to breakout pads, simplifying MCU power routing and decoupling capacitor placement.
- Ruler markings function as a pin-identification aid, printed adjacent to the top-side pads to mitigate the difficulty of locating pins on a small board.
- Underside reserved as a prototyping zone for 0201 surface-mount components.
- Enables rapid MCU prototyping using components reclaimed from discarded mobile devices.
### Improvements
- **Multi-angle capability**: The design now supports operation at multiple, non-rectilinear angles, which enhances visibility when the board is viewed from various orientations.
- **Wider trace geometry**: Traces have been broadened to reduce resistance and improve low-power performance of microcontrollers, leading to more efficient power consumption.
- **Optional header pins**: The layout includes provisions for adding header pins, facilitating easy connection of external peripherals or test equipment.
- **Enhanced 0201 prototyping grid**: The 0201-size surface-mount prototyping area has been refined, providing a more reliable platform for assembling and testing ultra-small components.
### Funding
This project received funding through [NGI0 Entrust](https://nlnet.nl/entrust), a fund established by [NLnet](https://nlnet.nl) with financial support from the European Commission's [Next Generation Internet](https://ngi.eu) program. Learn more at the [NLnet project page](https://nlnet.nl/project/Unbinare-RET).