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<div align="center">
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<img src="docs/images/UNBRK_HEX.png" style="max-width: 100%; height: auto";>
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</div>
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# UNBRK HEX
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# UNBRK HEX
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<div align="center">
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The UNBRK HEX is an improved and hexagonal version of the UNBRK breakout board. Like its predecessor, it supports QFP packages of 48, 64, 100, or 144 pins.
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<img src="docs/images/UNBRK_HEX.png" width="400" height="400">
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</div>
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The UNBRK HEX is an improved and hexagonal version of the UNBRK breakout board. Improvements include being able to work at multiple, non-rectilinear angles for improved visibiliy, wider traces for improved low-power operation
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### Features:
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of MCUs, the ability to add header pins and an improved 0201 prototyping grid.
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- Compact form factor suitable for space-constrained, low-power designs.
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- Supported QFP packages - Compatible with 48, 64, 100, and 144-pin QFP footprints.
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- VCC bus runs along all six edges of the top side.
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- GND bus runs along all six edges of the bottom side.
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- Buses are positioned adjacent to breakout pads, simplifying MCU power routing and decoupling capacitor placement.
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- Ruler markings function as a pin-identification aid, printed adjacent to the top-side pads to mitigate the difficulty of locating pins on a small board.
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- Underside reserved as a prototyping zone for 0201 surface-mount components.
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- Enables rapid MCU prototyping using components reclaimed from discarded mobile devices.
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### Improvements
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- **Multi-angle capability**: The design now supports operation at multiple, non-rectilinear angles, which enhances visibility when the board is viewed from various orientations.
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- **Wider trace geometry**: Traces have been broadened to reduce resistance and improve low-power performance of microcontrollers, leading to more efficient power consumption.
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- **Optional header pins**: The layout includes provisions for adding header pins, facilitating easy connection of external peripherals or test equipment.
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- **Enhanced 0201 prototyping grid**: The 0201-size surface-mount prototyping area has been refined, providing a more reliable platform for assembling and testing ultra-small components.
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### Funding
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This project received funding through [NGI0 Entrust](https://nlnet.nl/entrust), a fund established by [NLnet](https://nlnet.nl) with financial support from the European Commission's [Next Generation Internet](https://ngi.eu) program. Learn more at the [NLnet project page](https://nlnet.nl/project/Unbinare-RET).
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