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@@ -20,7 +20,7 @@ With the release of version 0.3, the DEDBUG platform has transitioned to a flexi
- **Dual-edge power bus**: A dedicated VCC/GND bus runs along the right-hand and bottom edges of the board, providing convenient current distribution.
- **Configurable edge connections**: The top right corner allows a wire or crocodile clip to be soldered, creating either a VCC or a GND bus on demand.
- **Flexible bridging options**: Edge pads can be linked to the bus, to adjacent edge pads, or to the central prototyping zone using either solid solder joints or 0402-size zero-ohm resistors, giving the researcher fine-grained control over connectivity.
- **Via-based pad pairing**: Corresponding edge pads on opposite sides are interconnected through plated-through vias; when one side hosts a VCC bus and the opposite side a GND bus, a single via bridge completes the circuit, making both rails available within the prototyping area.
- **Via-based pad pairing**: Corresponding edge pads on opposite sides are interconnected through plated-through vias; when one side hosts a VCC bus and the opposite side a GND bus, a single via bridge makes both rails available within the prototyping areas on either side.
- **Versatile prototyping region**: The central prototyping area supports both traditional wiring using enameled copper wire and wire-free bridging of the cross-shaped pads, accommodating rapid layout iterations.
- **Unique SMD component grid**: The prototyping grid is dimensioned for the most prevalent two-terminal surface-mount packages—0201, 0402, 0603, 0805, 1206, and 1210. This layout streamlines the assembly of high-density circuits that would otherwise be challenging to hand-solder, and it enables researchers to integrate any salvaged SMD component extracted from electronic waste.